ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,949, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device and method... और पढ़ें
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,950, issued on Aug. 18, was assigned to Intel Corp. (Santa Clara, Calif.). "Three-dimensional integration of dies in an integrated circuit ... और पढ़ें
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,951, issued on Aug. 18, was assigned to STATS ChipPAC Pte. Ltd. (Singapore). "Semiconductor device and method of making redistribution laye... और पढ़ें
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,952, issued on Aug. 18, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore). "Electronic devices and methods of manufa... और पढ़ें
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,953, issued on Aug. 18, was assigned to Avago Technologies International Sales Pte. Ltd. (Singapore). "Hybrid substrates and manufacturing ... और पढ़ें
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,954, issued on Aug. 18, was assigned to DENSO Corp. (Kariya, Japan). "Electronic apparatus" was invented by Kenichiro Takagi (Nisshin-city,... और पढ़ें
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,955, issued on Aug. 18, was assigned to Intel Corp. (Santa Clara, Calif.). "Integrated circuit packages including substrates with strengthe... और पढ़ें
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,956, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Pick and place method with dete... और पढ़ें
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,957, issued on Aug. 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Bonding scheme for semiconductor pa... और पढ़ें
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,958, issued on Aug. 18, was assigned to Avago Technologies International Sales Pte. Ltd. (Singapore). "Packaging systems and methods for se... और पढ़ें